PCB Capabilities

Process

Item

PCB Process Capabilities

Base Information

Production Capabilities

Layer count

1-30 layers

Bow and twist

0.75% standard, 0.5% advanced

Min. finished PCB size

10 x 10mm(0.4 x 0.4")

Max. finished PCB size

530 x 1200mm(20.9 x 47.24 ")

Multi-press for blind/buried vias

Multi-press Cycle < 3 times

Finished board thickness

0.3 ~ 7.0mm(8 ~ 276mil)

Finished board thickness tolerance

+/-10% standard, +/-0.1mm advanced

Surface finish

HASL, Lead free HASL, Flash gold, ENIG, OSP, Immersion Tin, Immersion silver, Hard gold plating, Thick film carbon resistor, etc

Selective surface finish

ENIG+OSP, ENIG+Gold finger, Flash gold+HASL

Material Type

Material

FR4, Ceramic, Alumina 96%AL2O3, Polyimide, SUS304

Impedance Control Material

FR4, FR4 High Tg series

RCC material

Copper foil thickness 12um, Dielectric Thickness 65,80,100um (55,70,90um after pressing)

Copper foil

1/3oz ~ 12oz

Prepreg Type

FR4 Prepreg, LD-1080(HDI)

106, 1080, 3313, 2313, 2116, 7628

Reliable Test

Peel strength

7.8N/cm

Fammability

94V-0

Ionic contamination

< 1ug/cm²

Min. dielectric thickness

0.075mm(3mil)

Impedance tolerance

+/-10% for impedance > 50Ω, +/-5Ω for impedance < 50Ω

Inner layer&Outer layer Image Transfer

Machine Capabilities

Scrubbing Machine

Material thickness: 0.11 ~ 3.2mm(4.33mil ~ 126mil)

Material size: min. 228 x 228mm(9 x 9")

Laminator, Exposer

Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil)

Material size: min 203 x 203mm(8 x 8"), max. 609.6 x 1200mm(24 x 30 ")

Etching Line

Material thickness: 0.11 ~ 6.0mm(4.33mil ~ 236mil)

Material size: min. 177 x 177mm(7 x 7")

Inner layer Process Capabilities

Min. inner line width/spacing

0.075/0.075mm(3/3mil)

Min. spacing from hole edge to conductive

0.2mm(8mil)

Min. inner layer annular ring

0.1mm(4mil)

Min. inner layer isolation clearance

0.25mm(10mil) standard, 0.2mm(8mil) advanced

Min. spacing from board edge to conductive

0.2mm(8mil)

Min. gap width between copper ground

0.127mm(5mil)

Unbalance copper thickness for inner core

H/1oz, 1/2oz

Max. finished copper thickness

5oz

Outer layer Process Capabilities

Min. outer line width/spacing

0.075/0.075mm(3/3mil)

Min. hole pad size

0.3mm(12mil)

Process Capabilities

Max. slot tenting size

5 x 3mm(196.8 x 118mil)

Max. tenting hole size

4.5mm(177.2mil)

Min. tenting land width

0.2mm(8mil)

Min. annular ring

0.1mm(4mil)

Min. BGA pitch

0.5mm(20mil)

AOI

Machine Capabilities

Orbotech SK-75 AOI

Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil)

Material size: max. 597 ~ 597mm(23.5 x 23.5")

Orbotech Ves Machine

Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil)

Material size: max. 597 ~ 597mm(23.5 x 23.5")

Drilling

Machine Capabilities

MT-CNC2600 Drill machine

Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil)

Material size: max. 470 ~ 660mm(18.5 x 26")

Min. drill size: 0.2mm(8mil)

Process Capabilities

Min. multi-hit drill bit size

0.55mm(21.6mil)

Max. aspect ratio(finished board size VS Drill size)

12:01

Hole location tolerance(compared with CAD)

+/-3mil

Counterbore hole

PTH&NPTH, Top angle 130°,Top diameter <6.3mm

Min. spacing from hole edge to conductive

0.2mm(8mil)

Max. drill bit size

6.5mm(256mil)

Min. multi-hit slot size

0.45mm(17.7mil)

Hole size tolerance for press fit

+/-0.05mm(+/-2mil)

PTH size tolerance

+/-0.075mm(+/-3.0mil)

NPTH size tolerance

+/-0.05mm(+/-2.0mil)

Min. spacing from hole edge to conductive(Blind vias)

0.23mm(9mil)

Min. laser drill size

0.1mm(+/-4mil)

Countersink hole angle&Diameter

Top 82,90,120°

Wet Process

Machine Capabilities

Panel&Pattern plating line

Material thickness: 0.2 ~ 7.0mm(8 ~276mil)

Material size: max. 610 x 762mm(24 x 30")

Deburring Maching

Material thickness: 0.2 ~ 7.0mm(8 ~276mil)

Material size: min. 203 x 203mm(8" x 8")

Desmear Line

Material thickness: 0.2mm ~ 7.0mm(8 ~276mil)

Material size: max. 610 x 762mm(24 x 30")

Tin plating line

Material thickness: 0.2 ~ 3.2mm(8 ~126mil)

Material size: max. 610 x 762mm(24 x 30")

Process Capabilities

Hole wall copper thickness

average 25um(1mil) standard

Finished copper thickness

>18um(0.7mil)

Min line width for etching marking

0.2mm(8mil))

Max.finished copper weight for inner&outer layers

7oz

Different copper thickness

H/1oz,1/2oz

Solder Mask& Silkscreen

Machine Capabilities

Scrubbing Machine

Material thickness: 0.5 ~ 7.0mm(20 ~ 276mil)

Material size: min. 228 x 228mm(9 x 9")

Exposer

Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil)

Material size: max. 635 x 813mm(25 x 32")

Develop machine

Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil)

Material size: min. 101 x 127mm(4 x 5")

Color

Solder mask color

Green, matte green, yellow, black, blue, red, white

Silkscreen color

White, yellow, black, blue

Solder Mask Capabilities

Min. solder mask opening

0.05mm(2mil)

Max. plugged via size

0.65mm(25.6mil)

Min. width for line coverage by S/M

0.05mm(2mil)

Min. solder mask legends width

0.2mm(8mil) standard, 0.17mm(7mil) advanced

Min. solder mask thickness

10um(0.4mil)

Solder mask thickness for via tenting

10um(0.4mil)

Min. carbon oil line width/spacing

0.25/0.35mm(10/14mil)

Min. tracer of carbon

0.06mm(2.5mil)

Min. carbon oil line trace

0.3mm(12mil))

Min. spacing from carbon pattern to pads

0.25mm(10mil)

Min. width for peelable mask cover line/pad

0.15mm(6mil)

Min. solder mask bridge width

0.1mm(4mil))

Solder mask Hardness

6H

Peelable Mask Capabilities

Min. spacing from peelable mask pattern to pad

0.3mm(12mil))

Max. size for peelable mask tent hole (By screen stencil printing)

2mm(7.8mil)

Max. size for peelable mask tent hole (By aluminum stencil printing)

4.5mm(15.8mil)

Peelable mask thickness

0.2 ~ 0.5mm(8 ~20mil)

Silkscreen Capabilities

Min. silkscreen line width

0.11mm(4.5mil)

Min. silkscreen line height

0.58mm(23mil)

Min. spacing from legend to pad

0.17mm(7mil)

Surface Finish

Surface Finish Capabilities

Max. gold finger length

50mm(2")

ENIG

3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) gold

gold finger

3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) gold

HASL

0.4um(0.016mil) Sn/Pb

HASL Machine

Material thickness: 0.6 ~ 4.0mm(23.6 ~ 157mil)

Material size: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25")

Thick film resistors

12um

Immersion Tin

0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin

Immersion Silver

0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag

OSP

0.2 ~ 0.5um(0.008 ~ 0.02mil)

E-Test

Machine Capabilities

Flying probe tester

Material thickness: 0.4 ~ 6.0mm(15.7 ~ 236mil)

Material size: max. 498 x 597mm(19.6 ~ 23.5")

Min. spacing from test pad to board edge

0.5mm(20mil)

Min. conductive resistance

5Ω

Max. insulation resistance

250mΩ

Max. test voltage

500V

Min. test pad size

0.15mm(6mil))

Min. test pad to pad spacing

0.25mm(10mil)

Max. test current

200mA

Profiling

Machine Capabilities

Profiling type

NC routing, V-cut, slot tabs, stamp hole

NC routing machine

Material thickness: 0.05 ~ 7.0mm(2 ~ 276mil)

Material size: max. 546 x 648mm(21.5 x 25.5")

V-cut machine

Material thickness: 0.6 ~ 3.0mm(23.6 ~ 118mil)

Max material width for V-cut: 457mm(18")

Process Capabilities

Min. routing bit size

0.6mm(23.6mil)

Min. outline tolerance

+/-0.1mm(+/-4mil)

V-cut angle type

20°, 30°, 45°, 60°

V-cut angle tolerance

+/-5°

V-cut registration tolerance

+/-0.1mm(+/-4mil)

V-cut web thickness tolerance

+/-0.05mm(+/-2mil)

Min. gold finger spacing

+/-0.15mm(+/-6mil)

Min. spacing to avoid gold finger tab bevelled

+/-0.17mm(+/-7mil)

Bevelling angle tolerance

+/-5°

Bevelling remain thickness tolerance

+/-0.127mm(+/-5mil)

Min. inner radius

0.4mm(15.7mil)

Min. spacing from conductive to outline

0.2mm(8mil)

Countersink/Counterbore depth tolerance

+/-0.1mm(+/-4mil)

Items

Description

Production Capabilities

Materials

Flex raw material (with adhensive)

ShengYi SF302: PI=0.5mil, 1mil, 2mil, Cu=0.5oz, 1oz

Panasonic RF-775/777 : PI=1mil, 2mil, 3mil, Cu=0.5oz, 1oz

Thinflex: PI=1mil, 2mil, Cu=0.33oz, 0.5oz, 1oz

Flex raw material (without adhesive)

ShengYi SF302: PI=0.5mil, 1mil, 2mil, Cu=0.5oz, 1oz

Panasonic RF-775/777 : PI=1mil, 2mil, 3mil, Cu=0.5oz, 1oz

Thinflex: PI=1mil, 2mil, Cu=0.33oz, 0.5oz, 1oz

Standard: PI=0.5mil, 1mil, 2mil, 3mil, 4mil；Cu=0.33oz, 0.5oz, 1oz, 2oz

Cover film

ShengYi SF302C: 0515, 0525, 1025, 2030

Thinflex: 0510, 1010

TaiHong FHK: 1025, 1035

Standard: CVL/AD=12.5/12.5um, 25/25um, 25/50um, 25/75um

Pure adhensive

TaiHong : AD=10um, 25um, 40um

ShengYi SF302B: AD=25um, 40um

TaiHong MHK : PI=3mil, 5mil, 7mil, 9mil

Standard: AD=10um, 15um, 25um, 40um, 50um；

No Flow Prepreg

EM370BL 106 75%, Thickness: 2.4-3.0mil; EM370BL 1080 68%, Thickness: 3.1-4.0mil

VT-447 1067 72%,Thickness: 2.2-3.0mil; VT-447 1078 56%,Thickness: 3.3-4.0mil

3M tape

9077, 6677, 9458

PI Stiffener

TaiHong MHK : PI=3mil, 5mil , 7mil, 9mil

Normal rigid board material

IT-180A, S1141, S1000-2

Special rigid board material

Arlon: 85N, Rogers: RO4000, Nelco: N4000-13, Ventec: VT-901

Special Capabilities

Layer count (flex layer)

2-12 layers

Finished board thickness

0.5mm-3.0mm (rigid)

Board thickness tolerance(>1.0mm)

board thickness ±10%

Impedance control tolerance

Singal end: ±5Ω(≤50Ω), ±10%(＞50Ω),

DIFF: ±5Ω(≤50Ω), ±10%(＞50Ω)

Bow and twist(min.)

0.75%(symmetry), 2%(asymmetry)

Min. distance from conductor to combine place for flex&rigid

0.5mm(through slot/half slot technolgy)

Suface finish

OSP, HAL/LF HAL,ENIG, ENPIG, Plating nickel gold copper, Plating soft gold, Plating hard gold, Immerison silver, Immersion Tin

Max panel size

220mm x 400mm

Substrates :

Alumina (Al2O3)

Aluminum Nitride (AlN)

Beryllium Oxide (BeO)

Zirconium Dioxide (ZrO2)

Max Application Temperature :

662 - 1832

1832

2300

2432

Max Power Density (W/in²):

75

1010

250

300

Max Ramp Up Speed (°F/sec):

122

572

400

350

Thermal Conductivity (W/mK):

20-35

180-220

200-300

2.0-5.0

Density (g/cm³):

3.75

3.26

2.8

5.9

Dielectric Loss:

0.0001 - 0.001

0.0001 - 0.0005

0.0001 - 0.0002

0.0005 - 0.001

Dielectric Constant:

9.4 - 10.2

8.5 - 9.0

6.0 - 7.0

25 - 30

CTE, ppm/ºC:

6.0 - 8.0

4.0 - 5.0

7.0 - 9.0

10.0 - 11.0

Substrate Thickness (mm):

0.25 - 2.0

0.25 - 2.0

0.25 - 2.0

0.25 - 2.0

Typical Max. Dimension (inch):

6 x 12

5 x 11

6 x 6

4 x 4

Theoretical Total Wattage (W):

5400

55000

15000

20000

Metalization Types :

Thick Film Substrates (Screen-Printed)

Thin Film Substrates (Photo-Imaged)

Process Types :

TFM Capabilities

HTCC / LTCC Capabilities

DBC Capabilities

DPC Capabilities

AMB Capabilities

Layer Counts :

1, 2, 3, 4, 5, 6 Layers

1, 2, 4, 6, 8, 10, 12 Layers

1, 2 Layers

1, 2 Layers

1, 2 Layers

Max Board Dimension :

200*230mm

200*200mm

138*178mm

138*190mm

114*114mm

Min Board Thickness :

0.25mm

0.25mm

0.30mm~0.40mm

0.25mm

0.25mm

Max Board Thickness :

2.2mm

2.0mm

1L: 1.6mm; 2L 2.0mm

2.0mm

1.8mm

Conductor Thickness :

10um - 20um

5um - 1500um

1oz - 9oz

1um - 1000um

1oz- 22oz

Min Line Width/Space :

8/8mil (0.20/0.20mm)

6/6mil (0.15/0.15mm)

10/10mil (0.25/0.25mm)

6/6mil (0.15/0.15mm)

12/12mil (0.30/0.30mm)

Substrates Types :

AI203, ALN, BeO, ZrO2

AI203, ALN, BeO, ZrO2

Al2O3, AlN, ZrO2, PbO, SiO2, ZTA, Si3N4, SiC, Sapphire, Polycrystalline Silicon, Piezoelectric Ceramics

Al2O3, AlN, ZrO2, PbO, SiO2, ZTA, Si3N4, SiC, Sapphire, Polycrystalline Silicon, Piezoelectric Ceramics

AI203, ALN, BeO, ZrO2, Si3N4

Min Hole Diameter :

4mil (0.15mm)

4mil (0.15mm)

4mil (0.1mm)

4mil (0.1mm)

4mil (0.1mm)

Outline Tolerance :

Laser: +/-0.05mm;

Die Punch: +/-0.10mm

Laser: +/-0.05mm;

Die Punch: +/-0.10mm

Laser: +/-0.05mm;

Die Punch: +/-0.10mm

Laser: +/-0.05mm;

Die Punch: +/-0.10mm

Laser: +/-0.05mm;

Die Punch: +/-0.10mm

Substrate Thickness :

0.25, 0.38, 0.50, 0.635, 0.80,1.0, 1.25, 1.5, 2.0mm, Customizable

0.25, 0.38, 0.50, 0.635, 0.80,1.0, 1.25, 1.5, 2.0mm, Customizable

0.25, 0.38, 0.50, 0.635, 0.80,1.0, 1.25, 1.5, 2.0mm, Customizable

0.25, 0.38, 0.50, 0.635, 0.80,1.0, 1.25, 1.5, 2.0mm, Customizable

0.25, 0.38, 0.50, 0.635, 0.80,1.0, 1.25, 1.5, 2.0mm, Customizable

Thickness Tolerance :

0.25-0.38: +/-0.03mm;

0.50-2.00: +/-0.05mm

0.25-0.38: +/-0.03mm;

0.50-2.00: +/-0.05mm

0.25-0.38: +/-0.03mm;

0.50-2.00: +/-0.05mm

0.25-0.38: +/-0.03mm;

0.50-2.00: +/-0.05mm

0.25-0.38: +/-0.03mm;

0.50-2.00: +/-0.05mm

Surface Treatment :

Ag, Au, AgPd, AuPd

Ag, Au, AgPd, AuPd, Mn/Ni

OSP/Ni Plating, ENIG

OSP/ENIG/ENEPIG

OSP/ENIG/ENEPIG

Min Solder PAD Dia :

10mil (0.25mm)

10mil (0.25mm)

8mil (0.20mm)

6mil (0.15mm)

8mil (0.20mm)

Items :

Typical Values

Advanced Capabilities

1, Substrates :

FR4, Ceramic ( AI203, ALN, BeO, ZrO2), Polyimide (Flexible PI), Stainless Steel (SUS304), Mica

FR4, Ceramic ( AI203, ALN, BeO, ZrO2), Polyimide (Flexible PI), Stainless Steel (SUS304), Mica

2, Conductor (Paste) Materials :

Copper, Silver , Gold , Silver-Palladium, Palladium-Gold, Platinum-Silver, Platinum-Gold

Copper, Silver , Gold , Silver-Palladium, Palladium-Gold, Platinum-Silver, Platinum-Gold

3, Thick Film Carbon Thickness (Height) :

15um +/-5 um

30um +/-5 um

4, Conductor Thickness (Height) :

12um+/-5um

20um+/-5um

5, Min Width of Thick Film Line :

0.30 mm +/-0.05 mm

0.20 mm +/-0.05 mm

6, Min Space of Thick Film Line :

0.30 mm +/-0.05 mm

0.20 mm +/-0.05 mm

7, Min Overlap (Carbon to Conductor) :

No less than 0.25mm

0.20mm (Minimum)

8, Sheet Resistivity (ohms/square):

Printed resistors in milli ohm to mega ohm range (Customizable) with tolerances of 1-10% are fabricated and protected with overglaze materials.

Printed resistors in milli ohm to mega ohm range (Customizable) with tolerances of 0.5-10% are fabricated and protected with overglaze materials.

9, Resistor Value Tolerance (ohms) :

+/-10.0% (Standard) (Customizable)

+/-0.5% (Laser trimming)

10, Linearity :

+/-1.0% (Standard) (Customizable)

+/-0.2 ~ +/-0.5% (Laser trimming)

11, Synchronism of Double Channels :

+/-2.0% (Standard) (Customizable) (Potentiometers)

+/-1.0% (Laser trimming) (Potentiometers)

12, Durability of Carbon Ink (Life time) :

0.5 Million (Min), 2.0 Million (Standard)

5.0-10.0 Million (Max) with Surface Polishing

13, Working Temperature :

－ 40ºC /＋150ºC

－ 40ºC /＋180ºC

Paste ( Materials) :

Conductor Width/Space

Soldering / Bonding

Gold :

8/8mil (0.20/0.20mm)

Gold is a good conductor material and allows thermo-compression gold wire bonding and eutectic die attachment. It is, of course, costly and has poor solderability.

Silver :

8/8mil (0.20/0.20mm)

Soldering & Silver is lower in cost, and solderable, but is not leach-resistant with tin/lead solders.More seriously, silver atoms migrate under the influence of DC electric fields, both causing short-circuits and reacting with many of the resistor paste formulations.

Platinum-Silver :

6/6mil (0.15/0.15mm)

Soldering & Surface Mount, Palladium and platinum alloyed to the gold and silver produce good conductor pastes,with good adhesion to the substrate, good solderability, and moderately good wire bonding characteristics.. Copper and nickel are examples of materials that have been proposed for paste systems as substitutes for noble metals.

Palladium-Silver :

8/8mil (0.20/0.20mm)

Soldering & Surface Mount ,Solderable, Wire bondable, (good aged adhesion general purpose), Silver-palladium conductor inks are the most commonly used materials, with both price and performance (primarily resistance to solder) increasing with palladium content.

Platinum-Gold :

6/6mil (0.15/0.15mm)

Soldering & Au or Al Wire Bonding, Solderable (excellent aged adhesion with no migration).

Palladium-Gold :

8/8mil (0.20/0.20mm)

Soldering & Au or Al Wire Bonding, Wire bondable.

Performances :

Common Values/Range

Description

Resistance Value :

1Ω to several MΩ

The resistance value depends on the type and ratio of carbon black, typically ranging from 1Ω to Mega ohm.

Resistance Tolerance :

±1% to ±10%

High-precision resistors can achieve ±0.1% tolerance used laser trimming process.

Temperature Coefficient (TCR) :

±50ppm/°C to ±200ppm/°C

High-quality resistive paste should have a low TCR, preferably below ±100ppm/°C.

Stability :

≤1%

Resistors must undergo high-temperature aging and humidity tests to ensure stability.

Sintering Temperature :

850°C to 950°C

The sintering temperature for carbon paste depends on material properties, typically in this range.

Conductivity :

10⁶ S/m to 10⁸ S/m

Conductivity depends on the type and ratio of carbon black, affecting resistance precision and stability.

Surface Smoothness :

Ra≤ 1 μm

The surface must be free of cracks, bubbles, and non-uniform layers to ensure good mechanical and electrical properties.

Insulation Resistance :

≥10⁹ Ω

Carbon paste should have good insulation properties to avoid leakage or short circuits.

Mechanical Strength :

≥100 MPa

The resistive layer must have good compressive and bending strength to ensure the reliability of the resistor.

Volatility :

Solvent residue ≤ 1%

High volatility solvents help with even coating and drying, but excessive volatility may affect electrical performance.

Oxidation Resistance :

>1000 hours

High-quality carbon paste should have strong oxidation resistance to extend the service life.

Humidity Resistance :

≥1000 hours

Resistors should be able to withstand high-humidity conditions to ensure long-term stable performance, no significant changes.

Performances :

Typical Value

Explanation

Material Types :

Epoxy Resin (Epoxy), Polyimide (PI), Polyurethane (PU), Polytetrafluoroethylene (PTFE), etc.

These resin types are commonly used to manufacture dielectric materials, providing good electrical insulation, thermal stability, and mechanical strength.

Dielectric Constant (εr) :

3 ~ 4.5 (Epoxy), 3.0 ~ 3.5 (PI), 2.1 ~ 2.5 (PTFE)

Epoxy and polyimide are typically used in low-to-medium frequency circuits, while PTFE is preferred for high-frequency applications due to its lower dielectric constant.

Insulation Resistance :

≥ 10¹² Ω·cm

Resin-based materials usually exhibit extremely high insulation resistance, effectively isolating electrical currents and preventing leakage.

Dielectric Loss :

≤ 0.01 (Epoxy), ≤ 0.005 (PI), ≤ 0.0002 (PTFE)

Polyimide and PTFE have lower dielectric loss, making them ideal for high-frequency applications.

Operating Temperature :

-55 ~ +180°C (Epoxy), -50 ~ +250°C (PI), -200 ~ +260°C (PTFE)

The sintering temperature for carbon paste depends on material properties, typically in this range.

Sintering Temperature :

150 ~ 200°C

Resin-based dielectric materials require lower sintering temperatures, making them more energy-efficient compared to ceramic materials.

CTE, ppm/ºC :

20 ~ 60 × 10⁻⁶ (Epoxy), 10 ~ 40 × 10⁻⁶ (PI), 100 ~ 200 × 10⁻⁶ (PTFE)

PTFE has a higher thermal expansion coefficient but offers excellent chemical stability and corrosion resistance. Epoxy and polyimide have lower coefficients, making them more thermally stable.

Volume Resistivity :

≥ 10¹³ Ω·cm

Resin materials typically have very high volume resistivity, making them ideal for electrical isolation applications.

Surface Resistivity :

≥ 10⁹ Ω·cm

Resin materials exhibit high surface resistivity, ensuring that surface leakage currents are minimized.

Thermal Conductivity :

0.2 ~ 0.3 (Epoxy), 0.2 ~ 0.3 (PI), 0.1 ~ 0.3 (PTFE)W/m·K

Resin materials have low thermal conductivity, requiring additional heat dissipation designs to ensure thermal stability.

Adhesion Strength :

≥ 20 N/cm²

Epoxy resin has good adhesion strength, making it suitable for various substrates, such as metal and ceramics.

Material Types :

Glass Enamel (Overglaze)

Epoxy Resin

Organic Polymers (Polyurethane, Polystyrene)

Insulation Resistance :

≥ 10¹² Ω·cm

≥ 10¹² Ω·cm

≥ 10¹² Ω·cm

Dielectric Constant (εr) :

5 ~ 7

3 ~ 4.5

2 ~ 3.5

Dielectric Loss :

≤ 0.01

≤ 0.01

≤ 0.01

Operating Temperature :

-40 ~ +450 °C

-55 ~ +180 °C

-40 ~ +150 °C

Sintering Temperature :

600 ~ 800 °C

150 ~ 200 °C

120 ~ 180 °C

Thermal Conductivity :

1.0 ~ 1.5 W/m·K

0.2 ~ 0.3 W/m·K

0.1 ~ 0.3 W/m·K

CTE, ppm/ºC :

30 ~ 50 × 10⁻⁶ /°C

30 ~ 60 × 10⁻⁶ /°C

50 ~ 150 × 10⁻⁶ /°C

Density :

2.5 ~ 3.0 g/cm³

1.1 ~ 1.4 g/cm³

1.1 ~ 1.4 g/cm³

Adhesion Strength :

High (suitable for metal substrates)

High, good adhesion properties

Medium (depends on polymer type)

Chemical Stability :

Excellent, resistant to acids, alkalis, and solvents

Good, resistant to most chemicals, but sensitive to some solvents

Moderate, some polymers like PVC have strong chemical resistance

Arc Resistance :

Excellent

Good

Moderate

Mechanical Strength :

High (hard and brittle)

Medium, good flexibility

Low, but good flexibility

Characteristics :

High-temperature sintering, excellent electrical insulation, good thermal and chemical stability

Low-temperature sintering, good adhesion and flexibility, good chemical resistance

Good flexibility, suitable for flexible circuits, but poor high-temperature performance