What is MCPCB ?

MCPCB or calls Metal Core PCB means printed cirucits on the base metal core material with normal PCB processing, The heat dissipation of metal core PCB is improved through affixing the common PCB to another copper or aluminum metal with better thermal conductivity.The metal substrate normally included aluminum, copper, iron and silicon steel plate, insulating media with high thermal conductivity.The main difference between a FR4 PCB and MCPCB is the thermal conductive dielectric material in the Metal Core PCB. This acts as a thermal bridge between the IC components or LED lighting and metal backing plate. Heat is conducted from the package through the metal core to another heat sink. In addition,The metal core PCB with both silicon,iron base and steel base are excellent in electrical properties, permeability, pressurization and high strength and are mainly used in brushless DC motor PCB, tape recorders PCB and intelligent driver PCB.

Panda PCB provided with good quality range of Metal Core PCB(MCPCB). Our extensive knowledge in this domain assists us in offering well managed MCPCB Fabrication Service. Our professionals make use of high thermal conductivity material(1.0-1.2w/mk) and cutting edge technology to manufacture and finish these products. we precisely test the entire range against various quality parameters to maintain the quality and avoid any kind of flaw, In our team, we have hired highly qualified and diligent professionals that possess immense expertise of this domain,The offered product is designed in complete compliance with the set industry standards & needs.

MCPCB Applications:

1. Automotive ECM, Automotive Electronics, LED PCB, ABS brakes, and power steering modules.

2. LED lighting PCB applications,Transport lighting,automobile lighting,interior lighting.

3. Power conversion devices, electric regulator ,voltage stabilizer ,Diskette Drive.

4. Motor Drives, Heat-Rail and Forming, Solid state relays/switches.

5. Servers and desktop computers.

MCPCB Capability:

Heat-Sink Technologies:


Typical Value

Material Supplier


Metal type

Copper, Aluminum, silico, iron, steel

Board Thickness


Metal Thickness

0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm, 1.0mm,1.2mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm

Dielectric thickness


Thermal Resistance

0.05 C-in2/watt

Thermal Conductivity


Glass Transition Temperature


Breakdown Voltage

2-6KV AC

Layer Count

Single and Double sided,Multi-layer with blind and buried via

Min trace width/spacing


Copper thickness

1-6 OZ

Min depth of Countsink


Hole size


Surface finish

HAL, LF-HASL, OSP, ENIG, Immersion Silver,Immersion tin, Silver plate, ENEPIG



Volume Resistiviry


Surface Resistivity

1.0X1010 (ohms)

Comparative Tracking Index


Water Absorption


Continuous Use Temperature

110-130 C

Peel Strength

4.5 lbs/in

1. Post Bonding Technologies(Coin inside,Press fit technology)

2. Pre-bonding (Copper or aluminum based) 

3. Sweat Soldering (Based metal sweat soldering)

4. Step Slot technology.

5. Copper and Silver Filled Technology (-Copper filled, -Silver filled)

Whole Post bonding

Partial post bonding

Coin inside technology

Press fit technology

Copper based

Aluminum based

Copper Filled Technology

Silver Filled Technology