Thick Film Technology

Thick Film Technologies, also known as Thick Film Solutions, are highly reliable manufacturing technologies widely used in the production of hybrid integrated circuits and semiconductor components, with the main fabrication processes involving applying conductive, resistive, dielectric, and insulating materials onto substrates such as PI, FR4, ceramics, or glass, followed by curing, high-temperature sintering, and laser trimming, which results in high-precision, diverse, and customizable thick-film hybrid integrated electronic circuits with excellent cost-effectiveness.

Thick Film Technologies are known for their high durability, versatility, and reliability. The materials used offer excellent electrical conductivity, thermal resistance, and stability, making them ideal for harsh environments. These technologies support high integration, allowing resistors, capacitors, and other components to be directly applied to substrates. Additionally, they can be customized to meet specific performance requirements, offering design flexibility while keeping manufacturing costs low.

Thick Film Solutions are widely used across industries such as automotive, telecommunications, consumer electronics, and medical devices. In automotive applications, they are found in engine control systems, sensors, and power modules, requiring high reliability and resistance to extreme temperatures. In telecommunications, they are integral to signal processing and network equipment. These technologies also play a key role in medical devices, where precision and high performance are critical. Their ability to integrate multiple functions into compact, reliable, and cost-effective components makes them essential in these fields, driving advancements in electronics and semiconductors.

Process Features of Thick Film Technology :

1, Substrate Preparation: The process begins with preparing the substrate, which is typically made of materials such as FR4, Alumina (Ceramic), Polyester, Polyimide (Flexible PCB), Stainless Steel (SUS304), Mica, and Metal Core. The substrate surface is meticulously cleaned and treated to ensure optimal adhesion of the thick film materials.

2, Thick Film Paste Preparation: The thick film paste used to create thick film circuits is broadly categorized into three types: Dielectric paste, Conductive paste, and Resistive paste. Dielectric paste is generally glass and ceramic-based and non-conductive. Conductive paste contains precious metal particles such as Silver, Gold, Silver-Palladium, Gold-Platinum, and their alloys. Resistive paste comprises blends of glasses, metals, and metal oxides, such as silver and ruthenium, in various combinations to achieve inks with different resistance values.

3, Thick Film Printing: The printing of thick film materials, including conductive pastes, resistive pastes, and dielectric pastes, onto the substrate is accomplished using various methods. Common techniques include screen printing, stencil printing, and inkjet printing.

4, Drying and Firing Process: Following the coating of thick film materials, the substrate undergoes a drying process to eliminate any solvents or moisture from the film. Subsequently, the substrate is fired in a high-temperature furnace to sinter and bond the thick film materials to the substrate. This involves pre-drying in an oven at 200°C before being baked at around 850°C. The firing temperature and time are precisely controlled to achieve the desired electrical and mechanical properties.

5, Metallization Process: Thick Film Technology utilizes various metals to barrel coat and plug holes drilled through the ceramic substrate. When incorporating metallized through holes in a design, the opposite side of the board can serve as a separated or connected circuit. PTH with metallization connections can be used to integrate various other conductor layers, providing a significant advantage when high circuit density is required.

6, Laser Trimming Process: Screen printed resistors produced by the normal process typically have a value tolerance of about +/-20%. Laser trimming can be employed to reduce variability to better than +/-1%. In laser trimming, each resistor is probed to measure its actual resistance. If it is below the nominal or target value, a laser selectively removes resistive material to reduce the area through which current flows, thereby increasing the resistance.

7, Post-Processing: Additional processes may be performed, as needed, once the thick film circuit or component is formed. These processes can include trimming, laser machining, encapsulation, and surface finishing to enhance the performance, durability, and aesthetics of the product.

Key Advantages of Thick Film Technology :

Thick Film Technology offers several key advantages that make it a popular choice in a wide range of electronic applications, especially in industries like automotive, telecommunications, power electronics, and consumer electronics.

1. Cost-Effective Production :
● Low Material Cost: The materials used in Thick Film Technology, such as conductive pastes and metal oxides, are generally less expensive compared to other technologies like thin film or semiconductor-based processes. This results in lower production costs, especially for high-volume manufacturing.

● Scalability: Thick Film Technology is suitable for mass production, and its processes (like screen printing) can be easily scaled to produce large quantities of components quickly and efficiently. This is ideal for applications that require cost-effective, high-volume manufacturing.

2. High Reliability :
● Long Lifespan: Thick Film Technology components tend to have a long operational life due to their solid and durable structure. They are less susceptible to failure due to physical wear and tear compared to some other technologies.

● Stable Performance: Thick Film Technology offers stable electrical properties over a wide range of temperatures and environmental conditions. This ensures reliable performance over time, even in harsh environments.

3. Versatility in Material Choices :
● Diverse Material Options: Thick Film Technology allows the use of a wide range of materials, including conductive, resistive, and insulating pastes. This gives designers flexibility in creating different types of components such as resistors, capacitors, inductors, and sensors on the same substrate.

● High-Performance Materials: Conductive materials like silver, gold, and palladium are commonly used, providing excellent electrical conductivity. Metal oxide materials used for resistive layers offer stability and precision for a wide range of resistances.

4. Ability to Handle High Power :
● Power Rating: Thick Film Technology components can handle higher power compared to other technologies (such as thin films) due to the thicker nature of the printed materials. This makes Thick Film Technology ideal for power electronics applications, such as high-voltage circuits, automotive electronics, and sensors.

● Improved Heat Dissipation: The thicker film layers allow for better heat dissipation, which is crucial in high-power applications. This helps in maintaining the reliability and performance of devices under high-temperature conditions.

5. Robustness and Durability :
● Environmental Resistance: Thick Film Technology components are highly durable and resistant to harsh environmental conditions. They can withstand extreme temperatures, moisture, and vibration, making them suitable for use in automotive, aerospace, industrial, and outdoor applications.

● Chemical Stability: Thick film components are also resistant to corrosion and oxidation, which makes them ideal for use in environments that expose them to chemicals or humidity.

6. Miniaturization and Integration :
● Small Form Factor: Thick Film Technology allows for the integration of multiple components (e.g., resistors, capacitors, and even inductors) on a single substrate, enabling more compact and miniaturized circuit designs. This is particularly beneficial in applications where space is limited.

● Multilayer Integration: Thick Film Technology can be used to create multilayer circuits, allowing for higher component density on the same substrate. This increases functionality while reducing the overall size of the final device.

7. Compatibility with Diverse Substrates :
● Wide Substrate Range: Thick Film Technology can be applied to various substrates, including ceramic, glass, and metal, making it highly versatile for different applications. Ceramics, in particular, are excellent for their high thermal conductivity and electrical insulation properties.

● Substrate Customization: Substrates can be tailored for specific applications. For example, ceramic substrates can be selected for their high thermal resistance, while glass substrates can be chosen for their transparency in certain optical applications.

8. Environmental and Sustainability Benefits :
● Lead-Free Options: Many thick film technologies are compatible with lead-free and environmentally friendly materials, helping manufacturers comply with environmental regulations (e.g., RoHS, WEEE).

● Reduced Energy Consumption: The manufacturing process for Thick Film Technology, particularly in terms of materials coating (such as screen printing), generally consumes less energy compared to other methods like thin film deposition, contributing to a lower environmental impact.

9. Customization and Design Flexibility :
● Design Freedom: Thick Film Technology allows for high flexibility in design. Circuit patterns can be easily customized to suit the specific needs of the application, and it's possible to fabricate both passive and active components on the same substrate.

● Prototyping and Small-Batch Production: Thick Film Technology is well-suited for prototyping and small-batch production. Designers can quickly iterate on new designs without significant investment in tooling or specialized equipment.

10. Excellent Electrical Performance :
● High Precision: The ability to control the resistance, capacitance, and inductance of thick film components with high precision ensures that Thick Film Technology is suitable for precision applications, such as sensors and RF circuits.

● Low Parasitic Effects: Since thick film components can be made directly onto substrates, there are fewer parasitic effects (such as inductance and capacitance) compared to traditional wire-bonded or leaded components.

Thick Film Technologies are valued for their cost-effectiveness, high power handling, reliability, and versatility in both materials and applications. These advantages make them a preferred choice for mass production of components that need to operate under harsh conditions, such as automotive electronics, power devices, sensors, and industrial applications. The ability to integrate multiple components onto a single substrate, along with excellent electrical performance and robustness, further strengthens their appeal in diverse electronic applications.

Typical Solutions Offered by Thick Film Technology :

Thick Film Technologies offer a range of solutions, including hybrid circuits, ceramic PCBs, heaters, resistors, and sensor systems. Products made with Thick Film Technologies feature excellent thermal conductivity, resistance to extreme temperatures and chemicals, and are suitable for mass production. These solutions are widely used in industries such as automotive, telecommunications, and medical devices, providing reliable and customizable components.

1, Thick Film Resistor PCBs are highly efficient and unique printed circuit boards that allow designers to selectively integrate resistive, capacitive sensors, or heating elements into electronic circuits, using thick-film technology to print conductive, resistive, and insulating materials to PI, FR4, or ceramic PCBs, followed by high-temperature curing, sintering, photolithography, and laser trimming processes, which form precise and reliable thick film hybrid circuits that provide customized solutions for various electronic systems.

2, Thick Film Circuits offer versatility and reliability by integrating conductive, resistive, and insulating materials on a single ceramic substrate. They are highly resistant to high temperatures, humidity, and mechanical stress, making them ideal for harsh environments. Cost-effective by reducing wiring and assembly needs, these circuits lower production costs while ensuring precise and durable components.

3, Thick Film Ceramic PCBs are built with ceramic substrates like alumina (aluminum oxide) or aluminum nitride, which offer superior thermal conductivity, mechanical strength, and chemical resistance compared to the traditional fiberglass epoxy (FR4) substrate found in standard PCBs. These ceramic materials make the PCBs highly suitable for applications in environments that demand high thermal management and resistance to harsh chemicals, mechanical stresses, and extreme temperatures.

4, Thick Film Heaters generate heat by passing an electric current through a resistive layer, utilizing the resistive heating effect to convert electrical energy into heat. The uniform thickness and stable materials of the resistive layer ensure even heat distribution, maintaining consistent heating performance. Additionally, thick film technology allows for precise customization of the heating areas, enabling adjustments to power and shape based on specific application requirements, thus providing accurate temperature control.

5, Thick Film Ceramic Resistors are precision electronic components designed to control the flow of current in a circuit, serving functions such as circuit regulation, power distribution, and protection, and are manufactured using thick film technology where resistive and conductive materials are printed onto a ceramic substrate, followed by high-temperature sintering and laser trimming to form a stable, durable, reliable, and customizable resistor element on the surface of the ceramic substrate.

6, Thick Film Sensors operate based on the principle of resistance change. The thick film material applied to the sensor's surface undergoes physical property changes in response to environmental factors such as temperature, pressure, or humidity, resulting in variations in resistance. For example, when external pressure changes, the thick film material inside the sensor may deform or compress, leading to a corresponding change in resistance. The sensor's circuit system continuously monitors these changes and outputs signals that reflect the changes in environmental parameters.

Product Types of Thick Film Technology :

1, Flexible Thick Film PCB (PI)

2, Thick Film Resistor PCB (FR4)

3, Thick Film Ceramic PCB (Ceramic)

4, Thick Film Potentiometer PCB

5, Thick Film Ceramic Resistors

6, Thick Film Hybrid Circuits

7, Thick Film Heating Elements

8, Thick Film Substrates

9, Hybrid Integrated Circuits (HIC)

Applications of Thick Film Solutions :

Thick Film Solutions are commonly used in various industries due to their versatile properties and cost-effectiveness. These solutions typically consist of a mix of conductive and non-conductive materials, applied to a substrate to create electronic circuits, sensors, and other components. Below are the primary applications of thick film solutions:

1, Electronics Manufacturing: Thick film solutions are predominantly used in the production of resistors, capacitors, inductors, and hybrid integrated circuits. The films are applied to ceramic substrates, where they form the basis for passive components that are essential in electronic devices such as mobile phones, computers, and automotive electronics.

2, Sensor Technology: Thick film technology is widely used in the creation of sensors, including temperature sensors, gas sensors, and pressure sensors. The films provide a robust and reliable method for detecting and converting physical phenomena into electrical signals.

3, Hybrid Circuits: Thick film solutions offer a way to create complex circuits on ceramic or FR4 substrates. These circuits combine active elements like semiconductors with passive components to form a complete functional system.

4, Power Electronics: Thick film materials are ideal for applications in power electronics, where high reliability and resistance to environmental stresses are required. This includes power resistors, high-voltage components, and power distribution systems.

5, Automotive Industry: Thick film solutions are used in automotive applications for components like ignition systems, electronic control units (ECUs), and sensors. The ability to withstand high temperatures and harsh conditions makes them suitable for automotive electronics.

6, Displays and Imaging: Thick film technology plays a role in display applications such as flat-panel displays, touchscreens, and image sensors. The films are used to create transparent conductive layers or electrode patterns.

7, Microwave and RF Applications: Due to their stability and resistance to environmental factors, thick films are employed in microwave and radio-frequency (RF) devices, including antennas, filters, and waveguides.

8, Solar Energy: In the solar energy sector, thick film solutions are applied in the production of photovoltaic cells and panels. The films contribute to efficient energy conversion and are used in various types of solar cells for both residential and industrial applications.

These applications highlight the broad and growing utility of thick film solutions in a range of industries, driven by their ability to provide precise and durable circuit patterns, cost-effectiveness, and adaptability to a variety of environments.

The Most Representative Applications of Thick Film Solutions :

1, Thick Film Resistor PCBs :

2, Thick Film Hybrid Circuits :

3, Thick Film Heaters :

1, Linear potentiometers , Rotary potentiometers.
2, Linear position sensor, Rotary position sensors, Swilrl actuator position sensor, Linear Transducer.
3, Steering systems, on agricultural machinery.
4, Idling Motor Control Module, Blower Motor.
5, Auto, motorcycle applications, Throttle Position Sensor, Fuel Level Sensor.
6, Headlight position sensor, Ride heightsteering angle measurement.
7, Plastic injection moulding machines.
8, Audio control system, Music Equipments.
9, Valve Positioning, Pedal Position Sensor.

1, High voltage ceramic resistor.
2, Helicopter mission computer systems.
3, Wing ice protection systems.
4, Missile fusing / seeker systems.
5, Suppressor circuits for aircraft lightning protection.
6, Electronic counter measures.
7, Aerospace / space inertial measurement units.
8, Aircraft engine controls.
9, Airborne phased array radars.
10, Optical test instrumentation.
11, Minesweeper sonar systems and beacons.

1, Storage room heaters.
2, Railway and road transport.
3, Storage water heaters and electro-boilers.
4, Cooling and defrosting.
5, Galvanic baths,Power plants.
6, Complex solutions.
7, Contact heating, Kitchen ranges.
8, Dishwashers and automatic washing machines.
9, Plastics industry and Vulcanisation industry.
10, Food Warming Devices, Coffee makers.
11, Air-conditioning units, 3D printers.
12, Sterilization, Packaging, Enclosures.

Typical Applications of Thick Film Solutions in Automotive Electronics :

Thick Film Solutions find various applications in automotive electronics due to its versatility, reliability, and cost-effectiveness. Here are some specific applications of thick film technology in the automotive industry:

1, Power Modules: Thick film solutions are employed in the manufacturing of power modules used in electric and hybrid vehicles. These modules incorporate thick film resistors, capacitors, and conductive traces to manage and distribute electrical power within the vehicle's propulsion and energy storage systems.

2, Throttle Position Sensor: Thick film solutions are employed in the production of throttle position sensors used in electronic throttle control systems. These sensors utilize resistive thick film materials to detect the position of the throttle valve, providing crucial input to the engine management system for precise fuel injection and power delivery.

3, Ignition Module: Thick film solutions are utilized in the manufacturing of ignition modules, particularly in the construction of ignition control units and ignition coil drivers. This technology enables the integration of resistors, capacitors, and conductive traces within the ignition module, contributing to reliable ignition timing and spark control.

4, Voltage Regulator: Thick film resistors are commonly used in voltage regulator modules within the vehicle's electrical system. These resistors play a key role in regulating voltage levels for various automotive electrical components, ensuring stable and consistent power supply under varying operating conditions.

5, Fuel Level Sensor: Thick film solutions are applied in the development of fuel level sensors used to measure the quantity of fuel in the vehicle's tank. By utilizing resistive thick film materials, these sensors provide accurate readings to the fuel gauge and onboard computer systems, allowing drivers to monitor fuel levels accurately.

6, Accelerator Pedal Position Sensor: A key application of Thick Film Solutions in automotive electronics, the Accelerator Pedal Position Sensor (APPS) detects the actual position of the driver’s accelerator pedal and sends this data to the Engine Control Unit (ECU). The ECU then adjusts engine power output and throttle response accordingly. The integration of Thick Film Solutions technology in APPS ensures high precision, reliability, and durability, meeting the stringent performance requirements of modern automotive sensors.

7, Heating Elements: Thick film solutions are applied to produce heating elements used in automotive applications such as seat heaters, heated mirrors, windshield defrosters, and diesel fuel heaters. These heating elements offer efficient and even heat distribution while withstanding the harsh conditions.

8, Displays and Instrumentation: Thick film solutions are used to create thin, robust, and customizable display panels for automotive instrument clusters, infotainment systems, and dashboard displays. The technology enables the production of high-resolution and durable displays suitable for automotive environments.

9, EV and HEV (Electric Vehicle and Hybrid Electric Vehicle): Thick film solutions can meet the electrical requirements of EV and HEV power modules. such as power modules for electric vehicles and hybrid electric vehicles, call for higher voltage and power from smaller circuits, requiring circuit materials capable of providing high voltage isolation with the efficient dissipation of heat from densely packed semiconductor devices.

In each of these applications, Thick Film Solutions offer benefits such as compact design, precise electrical characteristics, and the ability to withstand harsh automotive environments, making it an ideal choice for automotive electronic components.

Laser Trimming of Thick Film Technology :

● Laser trimming is a technique commonly used in thick film technology to precisely adjust the resistance values of resistors. In the manufacturing process of thick film circuits, resistors are screen-printed onto the ceramic substrate along with other conductive traces and components, Laser trimming is an essential technique utilized in thick film technology to ensure the accuracy and reliability of resistors and enhance the overall functionality of thick film hybrid circuits.

● However, due to variations in materials and printing processes, the resistors may have slight deviations from their intended resistance values. Laser trimming is employed to fine-tune these resistors to meet the desired specifications.

● During laser trimming, each resistor is probed and its actual resistance is measured. If the resistance is found to be too high or too low compared to the target value, a high-precision laser is used to selectively remove or ablate a small amount of the resistive material. By adjusting the dimensions of the resistor, the laser trimming process finely tunes the resistance to the desired value.

● Laser trimming offers several advantages in the production of thick film hybrid circuits. It enables precise resistance adjustment, allowing for tighter tolerance control and improved circuit performance. Additionally, laser trimming eliminates the need for using numerous resistor values and provides flexibility in achieving specific resistance values within a circuit design.

Typical Stack-Up of Multilayer-Thick Film Substrates :

A stack-up of Multilayer-Thick Film Substrates based on thick film technology typically involves the following layers:
1, Ceramic Substrates: Similar to thick film hybrid circuits, multilayer hybrid circuits also utilize ceramic substrates as the base layer. These substrates can be made of materials such as alumina (Al2O3), beryllium oxide (BeO), or aluminum nitride (AlN).

2, Conductive Layers: Multiple conductor layers are incorporated into the stack-up. These layers consist of metallic traces, typically made of materials like silver-palladium, gold-palladium, or other conductive metals. Each conductor layer contributes to the overall circuit connectivity.

3, Dielectric Layers: In between the conductor layers, dielectric layers are added for insulation. These layers provide electrical isolation between the different conductive layers, preventing signal interference and short circuits.

4, Vias: Vias are small openings that traverse through the dielectric layers, connecting the different conductor layers. They allow electrical signals to pass between the various layers and provide interlayer connectivity.

5, Plated Through-Holes (PTH): PTH refers to vias that extend through the entire stack-up, from the top to the bottom surface of the circuit. These through-holes are plated or filled with a conductive material, ensuring electrical continuity between the layers. By the way, Hole size greater than 0.45mm is not recommended.

6, Additional Layers: Depending on the complexity and functionality requirements of the circuit design, additional layers can be included. These may involve components such as capacitors, inductors, or resistors, which are integrated within the stack-up.

7, Solder Mask or Overglazes: A protective solder mask is applied on top of the circuit layers. This coating helps protect the circuit from moisture, temperature, and physical damage, ensuring its reliability and longevity.

Design Considerations of Thick Film Technology :

Thick Film Technologies require careful consideration of several factors in their designs to ensure the reliability, performance, and cost-effectiveness of the final products.

1. Material Selection :
● Conductive Materials: Metals like silver, gold, and palladium are commonly used for conductors due to their excellent conductivity. The choice of material should align with the desired electrical properties (e.g., resistivity, thermal stability).

● Resistive Materials: Metal oxides (e.g., ruthenium oxide, tin oxide) are typically used for resistors. Their resistivity can be adjusted by altering the composition, which is crucial for meeting specific resistance values.

● Insulating Materials: Glass frits and ceramics are used as dielectrics and insulating materials. They must have high dielectric strength and thermal stability to withstand operational conditions.

2. Layer Thickness :
● Film Thickness: The thickness of each film layer (conductive, resistive, and insulating) is critical. Thicker layers offer better power handling and insulation but can also increase resistance and affect signal integrity. Design must strike a balance based on application requirements.

● Uniformity: Achieving uniform thickness across the substrate is crucial for consistent electrical performance. Inconsistent layer thickness can lead to defects, such as short circuits or poor electrical contacts.

3. Substrate Material :
● Choice of Substrate: Common substrates include flexible PI, FR4, ceramic materials (e.g., alumina, beryllia), glass, and sometimes metal. The substrate material must be compatible with the printing process and firing temperature.

● Thermal Expansion: The coefficient of thermal expansion (CTE) of the substrate should match that of the thick film materials to avoid stresses or cracking due to temperature changes.

4. Circuit Design and Layout :
● Design Rules: Circuit layouts must account for the limitations of the thick film process, such as minimum line widths, spacing between layers, and the ability to print fine features. Standard design tools used in PCB design may need to be adjusted for the thicker, more rigid nature of Thick Film Technology.

● Electromagnetic Interference: Circuit layout should minimize interference by optimizing the placement of components like resistors, capacitors, and conductors. The layout should also ensure that signal paths are as short and direct as possible to reduce parasitic inductance and capacitance.

● Multilayer Integration: Designing a multilayer structure requires careful planning of the sequence in which layers are printed and fired. Each layer must be registered accurately to ensure proper alignment.

5. Firing and Sintering Conditions :
● Temperature Control: The firing process must be carefully controlled in terms of temperature and time to ensure that materials properly fuse to the substrate without causing thermal stresses or degradation of material properties.

● Firing Atmosphere: The firing atmosphere (oxidizing or reducing) can influence the characteristics of the materials, especially the conductive and resistive layers. The atmosphere should be chosen based on the material composition and desired electrical properties.

6. Power Handling and Heat Dissipation :
● Power Rating: Thick film components are often used in power applications, so the design must account for the power handling capability. The thicker the film, the better it can dissipate heat. However, heat management in high-power circuits still requires consideration of the layout and materials.

● Thermal Management: Ensure that heat is efficiently dissipated from high-power components. This may involve designing for good thermal conductivity in the substrate and ensuring that the components are spaced appropriately.

● Thermal Management: Ensure that heat is efficiently dissipated from high-power components. This may involve designing for good thermal conductivity in the substrate and ensuring that the components are spaced appropriately.

7. Cost and Scalability :
● Material Costs: High-performance conductive materials (such as silver or gold) can increase the cost of production. Design choices should balance material costs with the performance requirements.

● Manufacturing Scalability: Thick Film Technology is often used in high-volume manufacturing due to its cost efficiency. The design should consider how well the process can be scaled, ensuring consistency and reliability in mass production.

8. Reliability and Testing :
● Aging and Stability: The electrical properties of thick film materials can change over time due to environmental factors such as temperature fluctuations, moisture, and mechanical stress.

● Electrical Testing: After fabrication, components should undergo rigorous testing (e.g., resistance, capacitance, continuity tests) to ensure the design specifications.

9. Environmental Considerations :
● Moisture and Vibration Resistance: The design must ensure that thick film components can withstand environmental conditions, such as humidity, thermal cycling, and mechanical vibration, especially for applications like automotive or industrial electronics.

● Corrosion Resistance: Materials used in the thick film must be resistant to corrosion over time, especially in outdoor or harsh industrial environments.

10. Tolerance and Precision :
● Process Control: Tight control over the printing and firing processes is necessary to achieve the desired accuracy and consistency in the final product.

● Component Tolerances: The thick film process has inherent tolerances in terms of resistance values and physical dimensions. These tolerances should be specified during the design phase to ensure that the final product meets electrical and functional requirements.

Designing for Thick Film Substrates require a comprehensive approach that considers material selection, layer thickness, substrate compatibility, circuit layout, firing conditions, and environmental factors. The goal is to balance performance, durability, and cost while ensuring reliable and scalable production for the intended application.

Why Choose PANDA PCB For Thick Film Solutions ?

PANDA PCB Group is a leading manufacturer of Thick Film Solutions with over 20 years of experience in the design and fabrication, and there are several reasons why we are an excellent choice for this technology.

● Panda PCB has many years of experience in the field of thick film circuits. Our team of engineers possesses extensive knowledge and expertise in designing and manufacturing these circuits, ensuring that our products are of the highest quality.

● Panda PCB is committed to providing high-quality products to their customers. We use the best materials and follow strict quality control processes to ensure that each thick film hybrid circuit meets or exceeds industry standards. This dedication to quality translates into durable and reliable products that are built to last.

● Panda PCB offers customization options to meet the specific needs of their clients. We understand that each application may have unique requirements, and we are willing to work with our customers to develop a custom thick film resistor PCB solution that fits their needs.
In terms of manufacturing capabilities, Panda PCB Group has invested heavily in state-of-the-art equipment and facilities. This enables them to produce thick film hybrid circuits with exceptional precision and efficiency, ensuring consistent performance and reliable functionality.

● Panda PCB is a reputable and reliable provider of thick film solutions. Our expertise, focus on quality, customization options, advanced manufacturing facilities, and commitment to customer satisfaction make them an excellent choice for anyone in need of thick film circuits, thick film resistors and thick film heaters.

● Our standard thick film substrate materials include FR4, Flexible PI, Ceramic, Mica and Metal Core. Thick Film Solutions are the method for production of resistive electronic, which have four main applications including Thick Film Resistor PCB, Thick Film Ceramic Resistor, Thick Film Hybrid Circuits, and Thick Film Heaters.

Design Guidelines of Thick Film Technology :

We compiled a Thick Film Technology-Design Guidelines as attached for you to download, It is to better support our customers' needs in designing and applying Thick Film Technologies, This guide covers detailed information on product solutions, engineering design specifications, material properties, available manufacturing processes, and more.

We hope that this guide will assist customers in standardizing their design process while ensuring the manufacturability of the design data, ultimately improving product reliability and production efficiency. Customers are encouraged to refer to the guide when designing Thick Film Technologies to ensure adherence to best practices.

Capabilities of Thick Film Technology Are As Follows :