Thick Film Resistor PCB
Thick Film Resistor PCBs are highly efficient and unique printed circuit boards that allow designers to selectively integrate resistors, sensors, or heating elements into electronic circuits, using thick-film technology to print dielectric, conductive, resistive, or insulating materials to PI, FR4, or ceramic PCBs, followed by curing, high-temperature sintering, laser trimming, and polishing processes, which form precise and reliable thick film hybrid circuits that provide customized.......
Thick Film Ceramic PCB
Thick Film Ceramic PCBs are high-performance printed circuit boards made with ceramic as the base substrate, offering excellent thermal conductivity, high mechanical strength, and outstanding integration and customization capabilities, utilizing thick film hybrid circuit technology to print and cure conductive, resistive, and insulating materials layer by layer, followed by high-temperature sintering and laser trimming processes, ultimately forming special circuit.......
Thick Film Circuits
Thick Film Circuits are robust electronic circuits formed by applying conductive, resistive, and insulating materials onto ceramic or other substrates using a thick film printing process, followed by high-temperature sintering to ensure durability, reliability, and resistance to environmental factors like temperature fluctuations and mechanical stress, offering the ability to customize resistance values, sizes, and power handling, making them well-suited for demanding.......
Thick Film Heaters
Thick Film Heaters are efficient heating elements that use advanced thick film technology to print dielectric, resistive, conductive, and insulating materials onto flexible PI, ceramic, or stainless steel substrates, with a manufacturing process that involves precise material mixing, layer-by-layer printing, high-temperature sintering, and laser trimming to optimize heater design and performance, ensuring excellent resistance to high temperatures, wear, and corrosion for stable long-term.......
Thin Film Substrates
Thick Film Substrates are advanced electronic materials used for hybrid microcircuits and integrated electronics, typically made from ceramics, metals, or glass for their electrical insulation, thermal stability, and mechanical strength, with the process involving screen printing conductive patterns, resistors, capacitors, and other passive components onto the substrate followed by high-temperature firing to bond them, creating reliable, highly integrated circuits.......
Ceramic PCB
Ceramic PCBs, also known as Ceramic Substrate PCBs, are high-performance printed circuit boards that utilize ceramic materials (aluminum oxide, aluminum nitride, and beryllium oxide) as substrates, offering excellent thermal conductivity, mechanical strength, and insulation properties, with manufacturing processes involving thin-film metallization or thick-film metallization techniques to apply conductive materials to the substrates, followed by etching or high.......
HDI PCB
HDI PCBs, also called High Density Interconnect PCBs, are cutting-edge printed circuit boards designed with an exceptionally high density of electronic components and interconnections, achieved through features like narrower trace widths, reduced layer spacing, and the incorporation of microvias, as well as blind and buried vias, enabling a significantly higher number of connections within a compact area, which not only facilitates the miniaturization of electronic devices........
Rigid-Flex PCB
Rigid-Flex PCBs, also known as Rigid-Flexible PCBs, combine flexible and rigid PCB technologies, allowing designers to create complex 3D shapes by twisting, folding, and rolling the flexible substrates to meet the specific requirements of compact and high-performance final assemblies, making them ideal for applications where space, durability, and flexibility are essential, with the flexible substrates designed to remain in a constant state of flex and typically forming curves.......
Metal Core PCB
Metal Core PCBs, also known as MCPCBs, are specialized printed circuit boards designed for superior thermal management, featuring a metal substrate, commonly made of materials like aluminum, copper, or iron, that acts as a heat spreader to efficiently dissipate heat, improving the thermal conductivity of the PCB, which is essential for high-power applications involving heat-generating components, with the metal layer typically connected to an insulating material with.......
High Frequency PCB
High-Frequency PCBs, also known as Radio Frequency PCBs, are printed circuit boards designed for signal transmission with special requirements, aiming to transmit high-frequency signals with minimal signal loss and impedance mismatch, featuring properties such as low dielectric constant (Dk), low loss factor (Df), and low coefficient of thermal expansion (CTE), typically used in applications operating in the RF range, usually above 100 MHz, extending to several GHz or.......
Welcome to Panda PCB Technology Co., Ltd
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PANDA PCB GROUP
Panda PCB Technology Co., Ltd., established in 2005 and located in Foshan, China, is a high-tech enterprise specializing in thick film solutions and printed circuit boards integrating research, development, manufacturing, and sales operations. With over 20 years of steady growth, the company has earned the trust of a wide range of customers through advanced technology and high-quality products, becoming a globally recognized supplier of thick film resistor PCBs. Our product range includes thick film resistors, thick film sensors, thick film heaters, and high-performance printed circuit boards, which are widely used in automotive electronics, communication equipment, home appliances, medical electronics, industrial automation, and other fields. With a diverse product offerings, customizable solutions, strict quality control systems, and an international management system, the company has established an outstanding brand reputation in the global thick film resistor market, becoming the preferred partner for leading enterprises across various industries. As a trusted Thick Film Resistor PCB Supplier, Panda PCB Technology Co., Ltd. offers comprehensive solutions that combine cutting-edge design, expert manufacturing, and a robust quality management system. We are committed to delivering durable, cost-effective products that meet our clients' most demanding needs. Our focus on innovation and quality has established us as a globally recognized leader in the thick film resistor PCB supplier, ensuring we provide unrivaled reliability and performance worldwide. |
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Seizing the historical opportunity brought about by the rapid development of the electronics industry, Panda PCB Group has been a key player in the thick film resistor PCB industry for over 20 years. Adhering to a customer-oriented approach, technology-driven innovation, and a focus on quality, Panda PCB is dedicated to delivering high-quality PCBs. We are particularly committed to advancing our thick film solutions, which are used in various resistors, sensors and heaters. Our product range includes Thick Film Resistor PCBs, Thick Film Sensors, Thick Film Heaters, Thick Film Hybrid Circuits, Thin Film Substrates, Heavy Copper PCBs, Ceramic PCBs, HDI Boards, Flexible Boards, Rigid-Flex PCBs, High-Frequency and High-Speed Boards, Metal Core PCBs (MCPCB), and Thin Film Embedded Resistor PCBs, among others. Additionally, we offer various PCB-related services, such as PCB Layout Design, PCB Reverse Engineering, and Potentiometer Wipers. |
From prototype to mass production, combining the characteristics of product differentiation and high-end features, Panda PCB Group has built intelligent factories, including two major production bases in Foshan and Zhuhai, which follow international management systems, dedicated to advanced manufacturing, technological innovation, and lean production, continuously enhancing our competitiveness and capabilities. Panda PCB Group provides competitive, safe, and reliable products and solutions for customers in high-tech fields such as semiconductors, automotive electronics, communication equipment, medical devices, testing systems, aerospace, home electronics, rail transportation, AI smart terminals, and new energy.
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